MOMENTAN AUSVERKAUFT
Über dieses Produkt
Product Identifiers
PublisherWiley & Sons, Incorporated, John
ISBN-100471457728
ISBN-139780471457725
eBay Product ID (ePID)2523552
Product Key Features
Number of Pages680 Pages
Publication NameUlsi Semiconductor Technology Atlas
LanguageEnglish
Publication Year2003
SubjectElectronics / Semiconductors, Electron Microscopes & Microscopy, Electronics / Circuits / Vlsi & Ulsi
TypeTextbook
AuthorGeorge T. T. Sheng, Chih-Yuan Lu, Chih-Hang Tung
Subject AreaTechnology & Engineering, Science
FormatHardcover
Dimensions
Item Height1.5 in
Item Weight48.4 Oz
Item Length10.2 in
Item Width7.2 in
Additional Product Features
Intended AudienceScholarly & Professional
LCCN2003-049661
Reviews"...provides a historical introduction to the technology as well as coverage of the evolution of basic ULSI process problems and issue." ( IEEE Solid-State Circuits Society Newsletter , January 2004) "...strongly recommended..." (E-Streams , Vol. 7, No. 4)
Dewey Edition21
IllustratedYes
Dewey Decimal621.39/5
Table Of ContentFOREWORD ix PREFACE xi PART I 1 1 Microelectronics and Microscopy 3 2 ULSI Process Technology 36 3 Applications of TEM for Construction Analysis 61 4 TEM Sample Preparation Techniques 90 PART II 141 5 Ion Implantation and Substrate Defects 143 6 Dielectrics and Isolation 179 7 Silicides, Polycide, and Salicide 256 8 Metallization and Interconnects 287 PART III 343 9 ULSI Devices I: DRAM Cell with Planar Capacitor 345 10 ULSI Devices II: DRAM Cell with Stacked Capacitor 365 11 ULSI Devices III: DRAM Cell with Trench Capacitor 399 12 ULSI Devices IV: SRAM 445 PART IV 475 13 TEM in Failure Analysis 477 14 Novel Devices and Materials 526 15 TEM in Under Bump Metallization (UBM) and Advanced Electronics Packaging Technologies 558 16 High-Resolution TEM in Microelectronics 609 INDEX 647
SynopsisUltra Large Scale Integration (ULSI) refers to chips with more than 10,000,000 devices per chip. It is the natural outgrowth of VLSI (Very Large Scale Integration). ULSI Semiconductor Technology Atlas uses TEM (Transmission Electron Microscopy) micrographs to explain and illustrate ULSI process technologies and associated problems., More than 1,100 TEM images illustrate the science of ULSI The natural outgrowth of VLSI (Very Large Scale Integration), Ultra Large Scale Integration (ULSI) refers to semiconductor chips with more than 10 million devices per chip. Written by three renowned pioneers in their field, ULSI Semiconductor Technology Atlas uses examples and TEM (Transmission Electron Microscopy) micrographs to explain and illustrate ULSI process technologies and their associated problems. The first book available on the subject to be illustrated using TEM images, ULSI Semiconductor Technology Atlas is logically divided into four parts: Part I includes basic introductions to the ULSI process, device construction analysis, and TEM sample preparation Part II focuses on key ULSI modules ion implantation and defects, dielectrics and isolation structures, silicides/salicides, and metallization Part III examines integrated devices, including complete planar DRAM, stacked cell DRAM, and trench cell DRAM, as well as SRAM as examples for process integration and development Part IV emphasizes special applications, including TEM in advanced failure analysis, TEM in advanced packaging development and UBM (Under Bump Metallization) studies, and high-resolution TEM in microelectronics This innovative guide also provides engineers and managers in the microelectronics industry, as well as graduate students, with: More than 1,100 TEM images to illustrate the science of ULSI A historical introduction to the technology as well as coverage of the evolution of basic ULSI process problems and issues Discussion of TEM in other advanced microelectronics devices and materials, such as flash memories, SOI, SiGe devices, MEMS, and CD-ROMs, More than 1,100 TEM images illustrate the science of ULSI The natural outgrowth of VLSI (Very Large Scale Integration), Ultra Large Scale Integration (ULSI) refers to semiconductor chips with more than 10 million devices per chip. Written by three renowned pioneers in their field, ULSI Semiconductor Technology Atlas uses examples and TEM (Transmission Electron Microscopy) micrographs to explain and illustrate ULSI process technologies and their associated problems. The first book available on the subject to be illustrated using TEM images, ULSI Semiconductor Technology Atlas is logically divided into four parts: * Part I includes basic introductions to the ULSI process, device construction analysis, and TEM sample preparation * Part II focuses on key ULSI modules--ion implantation and defects, dielectrics and isolation structures, silicides/salicides, and metallization * Part III examines integrated devices, including complete planar DRAM, stacked cell DRAM, and trench cell DRAM, as well as SRAM as examples for process integration and development * Part IV emphasizes special applications, including TEM in advanced failure analysis, TEM in advanced packaging development and UBM (Under Bump Metallization) studies, and high-resolution TEM in microelectronics This innovative guide also provides engineers and managers in the microelectronics industry, as well as graduate students, with: * More than 1,100 TEM images to illustrate the science of ULSI * A historical introduction to the technology as well as coverage of the evolution of basic ULSI process problems and issues * Discussion of TEM in other advanced microelectronics devices and materials, such as flash memories, SOI, SiGe devices, MEMS, and CD-ROMs
LC Classification NumberTK7874.76.T86 2003
