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Electronic Packaging und Interconne..., Harper, Charles-

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Electronic Packaging and Interconne..., Harper, Charles
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ISBN
0071430482
EAN
9780071430487
Publication Name
N/A
Type
Hardback
Release Title
Electronic Packaging and Interconnection Handbook 4/E (ELECTRO...
Artist
Harper, Charles A.
Brand
N/A
Colour
N/A
Kategorie

Über dieses Produkt

Product Identifiers

Publisher
Mcgraw-Hill Education
ISBN-10
0071430482
ISBN-13
9780071430487
eBay Product ID (ePID)
30785714

Product Key Features

Edition
4
Book Title
Electronic Packaging and Interconnection Handbook 4/E
Number of Pages
1000 Pages
Language
English
Topic
Industrial Design / Packaging, Telecommunications
Publication Year
2004
Illustrator
Yes
Features
Revised
Genre
Technology & Engineering
Author
Charles A. Harper
Format
Hardcover

Dimensions

Item Height
2.8 in
Item Weight
62.4 Oz
Item Length
9.5 in
Item Width
7.3 in

Additional Product Features

Intended Audience
Trade
LCCN
2004-055959
Reviews
Intended for electronic engineers, this handbook describes the various approaches to handling thermal management issues in electronic packaging, the function and structure of connectors, and the properties of solder technologies for electronic assembly. Other topics of the ten chapters include integrated circuit packaging, ball grid arrays, hybrid microelectronics, multichip modules, chip scale packaging, flip chip attachment, and printed wiring boards. Originally published as Handbook of Electronic Packaging , the fourth edition adds material on microelectromechanical (MEM) systems and high speed technologies., Intended for electronic engineers, this handbook describes the various approaches to handling thermal management issues in electronic packaging, the function and structure of connectors, and the properties of solder technologies for electronic assembly. Other topics of the ten chapters include integrated circuit packaging, ball grid arrays, hybrid microelectronics, multichip modules, chip scale packaging, flip chip attachment, and printed wiring boards. Originally published as Handbook of Electronic Packaging, the fourth edition adds material on microelectromechanical (MEM) systems and high speed technologies., Intended for electronic engineers, this handbook describes the various approaches to handling thermal management issues in electronic packaging, the function and structure of connectors, and the properties of solder technologies for electronic assembly. Other topics of the ten chapters include integrated circuit packaging, ball grid arrays, hybrid microelectronics, multichip modules, chip scale packaging, flip chip attachment, and printed wiring boards. Originally published asHandbook of Electronic Packaging, the fourth edition adds material on microelectromechanical (MEM) systems and high speed technologies.
Dewey Edition
22
Dewey Decimal
621.381/046
Table Of Content
CONTRIBUTORS PREFACE Chapter 1: Plastics, Elastomers, and Composites Chapter 2: Adhesives, Underfills, and Coatings Chapter 3: Thermal Management Chapter 4: Connector and Interconnection Technology Chapter 5: Solder Technologies for Electronic Packaging and Assembly Chapter 6: Packaging and Interconnection of Integrated Circuits Chapter 7: Hybrid Microelectronics and Multichip Modules Chapter 8: Chip Scale, Flip Chip, and Advanced Chip Packaging Technologies Chapter 9: Rigid and Flexible Printed Circuit Board Technology Chapter 10: Packaging of High-Speed and Microwave Electronic Systems INDEX
Edition Description
Revised edition
Synopsis
Publisher's Note: Products purchased from Third Party sellers are not guaranteed by the publisher for quality, authenticity, or access to any online entitlements included with the product. THE MOST COMPREHENSIVE REFERENCE IN ELECTRONIC PACKAGING--COMPLETELY UPDATED From new materials and technologies to increasingly prevalent lead-free manufacturing practices, Electronic Packaging and Interconnection Handbook offers a unique source of key reference data, practical guidance, and circuit and package design basics. Through three best-selling editions, this classic reference has served those involved in the design, manufacture, testing, and use of all types of electronic packaging, becoming the most widely used reference in the industry. This thoroughly revised and expanded Fourth Edition adds new information on key MEMs; optoelectronic, single-chip, and high-speed technologies; and updates important chapters on ball grid array and flip chip technologies. Of interest to mechanical and electrical engineers, chemists, physicists, and materials scientists in all areas of the electronic packaging industry, the book takes a unique interdisciplinary approach to the field, allowing specialists in one area to understand the needs and responsibilities of others. Whether your area of expertise is design and manufacturing, quality control, or marketing, it's easy to see why the Fourth Edition of the Electronic Packaging and Interconnection Handbook makes an excellent addition to your reference arsenal. Written by a team of experts from around the globe, this remarkable volume covers all aspects of electronic packaging, including: Materials Thermal Management Shock, Vibration, and Operational Stress Management Connector and Interconnection Technologies Soldering and Cleaning Technologies Single Chip Packaging and Ball Grid Arrays Surface Mount Technology Hybrid and Multichip Modules Chip-Scale, Flip-Chip, and Direct-Chip Attachment Rigid and Flexible Printed-Wiring Boards Packaging High-Speed and Microwave Systems Packaging High-Voltage Systems Packaging of MEMs Systems Packaging of Optoelectronic Systems
LC Classification Number
TK7870.15.E42 2004

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